[Diy_efi] Here's a little micro to build on...

[Bill Shaw]

Same problem is killing xbox 360's by the millions right now.  It's got 
to be done right if it's going to last. When it's done with proper 
thermal considerations it (the bga) works well, but it's got to be done 
right to last.  GM (for one) seems to have licked the design and 
assembly problems to produce a robust device.

Bill

ian wrote:
> On Tue, 2007-09-04 at 14:44 -0400, joevitek at cfl.rr.com wrote:
>   
>> I agree. My experience so far with BGAs in a production environment has been pretty good, however, I am leary of using them in a high vibe, wide temp environment. Also, the A/D comments are very valid. I can't tell you how many revisions of silicon we went through with integrated A/Ds until we got it right. Very expensive learning curve...
>>     
>
> Small BGAs are actually space certified now. the problem in space is the
> extreme thermal stress which in PLCCs etc. is taken up by the leads.
>
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