DIY WBO2 construction

[bcroe at juno.com]

The basic purpose of thermal contact, is to minimize the
cross over distortion in the Ip booster.  To make them the
SAME temperature, rather than heat sink them.  Failure 
to do this probably will have little effect; the original 
design worked with atrocious distortion.  You could have 
some excess current flowing through Q3 and Q4, but 
probably not enough to do any damage.

Bruce Roe

On Wed, 16 Jan 2002 22:16:48 EST A79coupe at aol.com writes:
> In a message dated Thu, 10 Jan 2002  3:12:36 PM Eastern Standard 
> Time, 
> Steve.Flanagan at VerizonWireless.com writes:
> 
> > Kao,
> > 
> > One thing I noticed was that you need to put D6,Q3 
> and D7,Q4 in thermal contact.  This means you need 
> to mount the diodes about 1/4 inch elevated, and then 
> bend the transistors (Q3,Q4) and the diodes (D6,D7) 
> until they touch.  Q3 should touch D6, Q4 should 
> touch D7, you can use heat sink compound to make 
> sure you have good thermal contact.

> > There was a note on the schematic that mentioned this
> 
> I did not do this on my board.  What is the effect of 
> skipping this?  Can I just heatsink these components, 
> or do I need to disassemble and reassemble properly?
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